Ectron Corporation provides a full range of Printed Circuit Board design services, including designs that require high speed signals with signal integrity, matched length, controlled impedance. Ectron also provides PCB testing and assembly services for sub-assembly and final system-level products.

Because of our state-of-the-art SMT-line and engineering expertise, we can accommodate a high mix of product lines with varied volume and complexity, including through-hole parts.

Engineering Design Capabilities

  • Circuit Design and Simulation
  • High-Speed Circuit Design
  • Power Supply Design
  • Automated Test Equipment (ATE) Design and Integration
  • Field Programmable Device (FPGA) Design and Programming
  • Digital Signal Processor (DSP), Microcontroller, Microprocessor Hardware, Software and Firmware Designs including Operating Systems
  • Mechanical and Electro-Mechanical Systems Design
  • Box Build, Backplane and Enclosure Design
  • Cable Build and Design
  • Thermal And Air Flow Analysis

Testing Capabilities

  • Test Plan Development for Maximum Coverage
  • FPGA Design Stimulation and Verification
  • Automated Test Equipment (ATE) Development
  • Assembled PCB Functional Testing
  • Thermal and Vibration
  • Hight POT Testing
  • Full Functional and Acceptance Testing of Systems and Subsystems

PCB Manufacturing Capabilities

  • Multi-Layer PCBs with Through-Hole Parts and Surface Mount Parts (including 0402 discrete components and FPGA and common component package types and sizes including resistors, capacitors, diodes, SOTs, PLCCs, QFPs, SOJs, SOPs)
  • Advanced Optical Imaging (AOI) Capability
  • High-Mix, Low Volume to High-Mix, High Volume
  • Maximum Board Size: 350mm x 1250 mm (13.7” x 49.2”)
  • RoHS (Restriction of Use of Hazardous Substances) Process : Lead (Pb) Free Assembly
  • ITAR-Compliant Services Available